Technical Details

• Package / Case 216-WFBGA
• Mounting Type Surface Mount
• Memory Size 8Gbit
• Memory Type Volatile
• Operating Temperature -30°C ~ 85°C (TC)
• Voltage - Supply 1.14V ~ 1.95V
• Technology SDRAM - Mobile LPDDR3
• Clock Frequency 800 MHz
• Memory Format DRAM
• Supplier Device Package 216-FBGA (12x12)
• Memory Interface Parallel
• Memory Organization 128M x 64
• DigiKey Programmable Not Verified
• ECCN OBSOLETE
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant